What kind of CPU packaging is designed to fit into a ZIF socket?
A) Single Edge Contact Cartridge (SECC)
B) Dual In-line Package (DIP)
C) Pin Grid Array (PGA)
D) Leadless Chip Carrier (LCC)
The answer: C) Pin Grid Array (PGA)
The combination of zero insertion force sockets and pin grid array processor packages allowed for more complex CPU interfaces to be easily integrated onto motherboards with no harmful pressure.
The incorrect answers:
A) Single Edge Contact Cartridge (SECC)
Single edge cartridges connected to the motherboard through a single slot that resembled a PCI slot interface.
B) Dual In-line Package (DIP)
The pins of dual in-line package processors are directly soldered or pushed onto sockets on the motherboard. Surface mount technology has effectively replaced dual in-line packages.
D) Leadless Chip Carrier (LCC)
LCC packaged chips like the Intel 80286 used plastic leadless chip carrier sockets on motherboards.
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Want to know more? Watch “CPU Sockets.”The configurations of CPUs onto a motherboard consist of a diverse set of slots, sockets, and connections. In this video, we’ll highlight some of these sockets types and show how a pin grid array processor fits into the zero insertion force sockets of today’s motherboards. |